Thick film · Thin film
TF-3050 S3
Laser Trimmer S3
The S3 is the workhorse platform: image-assisted navigation paired with a precise motion control system, covering all chip resistor sizes up to 0201 in both thick and thin film, with a measurement system built for milliohm-to-megohm work.
Operating envelope
- Minimum chip size
- 0201
- Resistance range
- 1 mΩ – 30 MΩ
- Wavelengths
- 1064 / 532 / 355 nm
- Substrate
- on request
Capabilities
- Covers all resistor sizes up to 0201
- Measurement range from milliohms to megohms
- Image-assisted navigation paired with a precise motion control system
- Finely tunable final product holder
- Accurate and rapid measurement system
- TrimSharp reverse-cut trimming for milliohm applications
- Compact single-carriage frame
- Integrated laser power meter for accurate power measurement
- Available with infrared fibre, 532 nm green, 355 nm ultraviolet or picosecond green sources
Configurations
Series 3T with full handler
Series 3T full handler, CE marked
Series 3TG
Series 3TH
Specifications
Figures marked on request are confirmed per application. Ask and we will send them.
| Laser | |
|---|---|
| Laser type | Diode pumped, Q-switched |
| Wavelength | 1064 nm; 532 nm, 355 nm and picosecond green available |
| Spot size | on request |
| Pulse repetition rate | on request |
| Trimming envelope | |
| Minimum chip size | 0201 (inch) |
| Film type | Thick film and thin film |
| Resistance range | 1 mΩ – 30 MΩ |
| Trim geometryL-cut confirmed on thick film product | on request |
| Trim tolerance | on request |
| Throughput | on request |
| Measurement | |
| Measurement range | 1 mΩ – 30 MΩ |
| Measurement resolution | on request |
| Kelvin measurement | on request |
| Vision and motion | |
| Alignment | Image-assisted navigation |
| Product holder | Finely tunable |
| Positioning accuracy | on request |
| Repeatability | on request |
| Handling | |
| Magazines | on request |
| Substrate size | on request |
| Software and control | |
| Operating system | Windows 10; Windows 11 on CE configurations |
| Trimmer software | WINLTS |
| Data logging / SPC export | on request |
| Trim modes | |
| TrimSharp (reverse cut)Second pass cut in reverse at higher beam speed and lower power — cleaner kerf, less TCR shift, longer diode life | Standard |
| P-Mode cut types | L-cut, line cut, ¼ circle cut, dummy cut |
| Segmented cuts | Segmented box, segmented U |
| Safety and compliance | |
| CE marking | CE marked (S8T CE configuration) |
| Safety door interlock | Interlocked enclosure, CE certified |
| EMC | EMC tested to CE requirements |
| Operator signalling | Three-colour signal tower, emergency stop |
| Enclosure | Fully enclosed beam path with laser-safety viewing window |
| Labelling | Safety terms and symbols to CE marking requirements |
| Facility | |
| Footprint | on request |
| Power | on request |
| Compressed air | on request |
Downloads
Datasheet in preparation — request it and we will send the current revision.