Thin film
TF-3050 S8
Thin Film Laser Trimmer S8
The S8 trims thin film chip resistors down to 0201 across a milliohm-to-megohm range, and can be configured with infrared, green or ultraviolet sources depending on the substrate and the finish your process demands.
Operating envelope
- Minimum chip size
- 0201
- Resistance range
- 1 mΩ – 30 MΩ
- Wavelengths
- 355 / 532 / 1064 nm
- Substrate
- on request
Capabilities
- Trims substrates with resistors down to 0201 (inch)
- Trims resistance values from milliohms to megohms
- Advanced vision and motion subsystems for improved positioning and alignment
- Improved pick-up arm for efficient substrate handling
- Windows 10 with WINLTS trimmer software (English / Chinese)
- Configurable with 355 nm, 532 nm or 1064 nm sources
- TrimSharp reverse-cut trimming for milliohm applications
- Compact single-carriage frame
- Integrated laser power meter for accurate power measurement
- Air-cooled or water-cooled laser source
Configurations
TF-3050 Series 8T, CE marked
Air-cooled laser source
Water-cooled laser source
Specifications
Figures marked on request are confirmed per application. Ask and we will send them.
| Laser | |
|---|---|
| Laser type | Diode pumped, Q-switched; fibre and picosecond options |
| WavelengthConfigured to application; 532 nm is the standard thin film build | 355 nm / 532 nm / 1064 nm |
| Spot size | on request |
| Pulse repetition rate | on request |
| Trimming envelope | |
| Minimum chip size | 0201 (inch) |
| Film type | Thin film |
| Resistance range | 1 mΩ – 30 MΩ |
| Trim geometryL-cut, plunge | on request |
| Trim tolerance | on request |
| Throughput | on request |
| Measurement | |
| Measurement range | 1 mΩ – 30 MΩ |
| Measurement resolution | on request |
| Kelvin measurement | on request |
| Defect detection and isolation | on request |
| Vision and motion | |
| Alignment | Vision-assisted with theta correction |
| Positioning accuracy | on request |
| Repeatability | on request |
| Handling | |
| Substrate handling | Improved pick-up arm |
| Magazines | on request |
| Substrate size | on request |
| Software and control | |
| Operating system | Windows 10; Windows 11 on CE configurations |
| Trimmer software | WINLTS |
| Interface languages | English, Chinese |
| Data logging / SPC export | on request |
| Trim modes | |
| TrimSharp (reverse cut)Second pass cut in reverse at higher beam speed and lower power — cleaner kerf, less TCR shift, longer diode life | Standard |
| P-Mode cut types | L-cut, line cut, ¼ circle cut, dummy cut |
| Segmented cuts | Segmented box, segmented U |
| Safety and compliance | |
| CE marking | CE marked (S8T CE configuration) |
| Safety door interlock | Interlocked enclosure, CE certified |
| EMC | EMC tested to CE requirements |
| Operator signalling | Three-colour signal tower, emergency stop |
| Enclosure | Fully enclosed beam path with laser-safety viewing window |
| Labelling | Safety terms and symbols to CE marking requirements |
| Facility | |
| Footprint | on request |
| Power | on request |
| Compressed air | on request |
Downloads
Datasheet in preparation — request it and we will send the current revision.