Installed base

Historic products

Every laser trim system LaserTek shipped from Series 2 onward, with the original datasheets. Many of these machines are still running in production today.

If you operate one of these, this page is here to help you identify what you have and what it can do. We continue to supply spare parts, calibration standards and service for them.

One platform underneath

The specifications below are identical on every machine in this archive — chip trimmers and functional trimmers alike, across every generation. That is why a probe card, a switching card or a set of calibration standards carries across the range, and why an operator trained on a Series 2 machine is already most of the way to running a Series 3.

Measurement system

Mode: Dual — force current and force voltage
Range: 0.1 Ω – 30 MΩ (10 mΩ optional)
Accuracy: 0.02 % midrange
Repeatability: 0.01 % midrange
Resolution: 0.005 %
Measurement time: 50 µs
Calibration standards: 6 pcs, 0.01 %
Guard drive current: 100 mA
Guard offset: 1 mV

Switching matrix

Pins per card: 16
Lines per pin: 3 — force, sense, guard
Switch type: Dry reed relay
Contact life: 1 billion cycles
Insulation: > 10 GΩ
Switching time: 200 µs

Beam delivery and motion

Beam positioning: Precision high-speed galvanometer
Positioning resolution: 1.5 µm
Positioning repeatability: 2.5 µm
Focus lens: Flat telecentric
XY resolution: 1 µm
Theta control: Motorised

Facility requirements

Power: 220 V AC, single phase, 10 A, 50/60 Hz
Compressed air: 80 – 100 psi, 10 cfm
Vacuum: 100 CFM factory vacuum — debris removal and substrate retention

Chip trimmer

Series 2

The generation that established the platform. Infrared at 1064 nm for thick film, green at 532 nm for thin, dual-carriage motion at 600 mm/s, and dual magazines with elevators. Pulse width is what separates the thick film variants — 30 ns on the J40 through to 150 ns on the LDP pair — and it is the parameter to match to your paste.

Model	Film	Min chip	Wavelength	Output power	Pulse width	Spot size	Field size	Footprint	Weight	Software	Handling	Datasheet
TF-3050 LDP10TQ	Thick film	0.04" × 0.02"	1064 nm	6 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	2125 × 966 × 1858 mm	1000 kg	DOS (WinLts 2 optional)	Dual magazines with elevators	PDF · 0.6 MB
TF-3050 LDP15TQ	Thick film	0.04" × 0.02"	1064 nm	12 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	2125 × 966 × 1858 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.6 MB
TF-3050 J40	Thick film	0201 (0.02" × 0.01")	1064 nm	6 W @ 10 kHz	30 ns	18 – 40 µm	12 × 90 mm	1490 × 1028 × 1843.5 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.3 MB
TF-3050G BL8S	Thin film	0.04" × 0.02"	532 nm	1.5 W @ 20 kHz	7 ns	8 – 10 µm	12 × 75 mm	1490 × 1028 × 1843.5 mm	—	DOS	Dual magazines with elevators	PDF · 0.9 MB
TF-2010G Y70	Thick film	01005 (0.01" × 0.005")	532 nm	3 W @ 7.5 kHz	70 ns @ 1 kHz	11 – 25 µm	12 × 75 mm	1820 × 1070 × 2050 mm	—	LTS2010, Windows XP	Rotary control, two magazine sets	PDF · 0.7 MB

TF-3050 LDP10TQ

150 ns · 6 W @ 10 kHz

Longest pulse of the Series 2 range at 150 ns — energy is delivered over a long enough window to cut coarse thick film without chipping the ceramic beneath
Largest frame in the archive, with the laser supply in its own bay for easier service access
The last machine shipped with DOS application software; WinLts 2 was offered as an upgrade

Original datasheet

TF-3050 LDP15TQ

150 ns · 12 W @ 10 kHz

12 W average power — double every other machine of the generation, and the highest in the archive alongside the Series 3 LDP15TQ
Same 150 ns pulse as the LDP10TQ, so kerf character is unchanged; the gain is purely cutting rate
Shipped with WinLts 2 on Windows XP as standard rather than as an option

Original datasheet

TF-3050 J40

30 ns · 6 W @ 10 kHz

30 ns pulse — five times shorter than the LDP machines, putting less heat into the substrate and leaving a cleaner kerf edge
First of the family specified for 0201 as well as 0.04" × 0.02"
Built-in pattern recognition for auto-compensation, and intelligent sensors that detect and isolate defective parts
Roughly 30 % narrower than the LDP frames at 1490 mm

Original datasheet

TF-3050G BL8S

7 ns · 1.5 W @ 20 kHz

8 – 10 µm spot — the finest in the archive, roughly a quarter of the 1064 nm machines' 18 – 40 µm, which is what thin film geometry demands
7 ns pulse at 532 nm: short and green, so very little thermal load reaches the NiCr or TaN film
TEM₀₀ beam over a 1 – 100 kHz frequency range
Carriages on independent air-cooled brushless DC servo stages, with a pneumatically counter-balanced prober
Takes 50 × 60 mm and 60 × 70 mm substrates

Original datasheet

TF-2010G Y70

70 ns @ 1 kHz · 3 W @ 7.5 kHz

The only machine in the archive rated for 01005 as well as 0201 — the finest chip geometry LaserTek shipped in this era
Wireless probe card with very low contact resistance and shielded cabling, for the most stable measurement of the generation
Rotary magazine control rather than dual elevators, cutting idle time between substrates
Pattern-recognition alignment and sensors that detect part breakage along both edges
12 switching cards as standard, where the TF-3050 machines ship with 10

Original datasheet

Chip trimmer

Series 3

A new handler rather than a new laser. The step-and-repeat stage runs at 1500 mm/s with 1.2 G acceleration and a 30 ms index, fed from a 360-piece 0402 cartridge, and the machine shed 100 kg and 180 mm of width in the process. The five variants are one machine offered at five pulse widths, from 50 ns to 150 ns.

Model	Film	Min chip	Wavelength	Output power	Pulse width	Spot size	Field size	Footprint	Weight	Software	Handling	Datasheet
TF-3050 LEP50	Thick film	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	50 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LEP60/C	Thick film	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	60 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LEP70	Thick film	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	70 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LDP10TQ	Thick film	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LDP15TQ	Thick film	0402 cartridge (360 pcs)	1064 nm	12 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.2 MB

TF-3050 LEP50

50 ns · 6 W @ 10 kHz

Shortest pulse of the Series 3 range at 50 ns — the cleanest cut where trim tolerance matters more than removal rate
Step-and-repeat stage at 1500 mm/s and 1.2 G with a 30 ms index — a step change over the 600 mm/s carriages of Series 2
Smallest and lightest machine in the archive at 1310 mm and 900 kg

Original datasheet

TF-3050 LEP60/C

60 ns · 6 W @ 10 kHz

60 ns sits between the LEP50 and LEP70 — the middle setting when a paste cuts poorly at 50 ns but does not need 70 ns
Identical platform, handler and measurement chain to the rest of Series 3, so the choice is purely a process one

Original datasheet

TF-3050 LEP70

70 ns · 6 W @ 10 kHz

Longest of the LEP pulse options at 70 ns — more energy per pulse for thicker or more resistant pastes, while staying well short of the 150 ns LDP machines
Same throughput as the rest of Series 3; the trade is cut character, not rate

Original datasheet

TF-3050 LDP10TQ

150 ns · 6 W @ 10 kHz

Series 2 thick film cutting character — the same 150 ns pulse — on the faster, smaller Series 3 step-and-repeat platform
The natural upgrade path for a shop running a Series 2 LDP10TQ that wants throughput without requalifying the trim

Original datasheet

TF-3050 LDP15TQ

150 ns · 12 W @ 10 kHz

The most capable machine in the archive on paper: 12 W at 150 ns on the Series 3 platform — highest power and fastest handler together
Suited to the heaviest thick film removal where cycle time governs

Original datasheet

Chip trimmer

Series 5

One variant survives in the archive. Its published specification matches the Series 2 J40 closely enough that we flag it rather than present it as settled.

Model	Film	Min chip	Wavelength	Output power	Pulse width	Spot size	Field size	Footprint	Weight	Software	Handling	Datasheet
TF-3050 X30	Thick film	0201 (0.02" × 0.01")	1064 nm	6 W @ 10 kHz	30 ns	18 – 40 µm	12 × 90 mm	1490 × 1028 × 1843.5 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.3 MB

TF-3050 X30

30 ns · 6 W @ 10 kHz

30 ns at 1064 nm with 0201 capability and built-in pattern recognition
Rated from ohms to megohms rather than milliohms — the headline claim differs from the otherwise identical Series 2 J40 sheet

The archived Series 5 X30 datasheet is specification-identical to the Series 2 J40 apart from the resistance-range wording. Confirm with engineering before quoting this sheet as the Series 5 specification.

Original datasheet

Functional trimmer

TF-5900 platform

A different machine for a different job, and now out of production. Where the chip trimmers scan a 12 × 90 mm strip and measure one resistor at a time, the TF-5900 scanned a 50 × 50 mm area and drove the whole board through a GPIB instrument rack — power supply, multimeter, function generator — trimming while the device was switched on and watching its output settle. Two frames were built: the auto-handler A, also sold earlier as the Series 2 Y70, and the lighter single-carriage L.

Model	Film	Max panel	Wavelength	Output power	Pulse width	Spot size	Field size	Footprint	Weight	Software	Handling	Datasheet
TF-5900 A	Thick film	5" × 5" panel	1064 nm	6 W @ 10 kHz	70 ns	20 – 40 µm	50 × 50 mm	1865 × 2355 × 1952 mm	1470 kg	LTS2010, Windows XP	Auto handler, dual carriage, two custom magazines	PDF · 0.8 MB
TF-5900 L	Thick film	4" × 4" panel	1064 nm	6 W @ 10 kHz	70 ns	20 – 40 µm	50 × 50 mm	1720 × 1070 × 1853 mm	1010 kg	LTS2010, Windows XP	Single carriage, pneumatic pick and place	PDF · 0.3 MB

TF-5900 A

70 ns · 6 W @ 10 kHz

The auto-handler frame of the functional platform: dual carriage, conveyor and transfer zone, two custom magazines
Also shipped as the Series 2 Y70 — the same machine under an earlier designation, so both datasheets describe one nameplate
GPIB interface and 7U instrument rack for trimming devices under power and measuring their final output
50 × 50 mm field with a 255 mm lens — an area rather than the 12 × 90 mm strip the chip trimmers scan

Original datasheet Earlier designation (Series 2 Y70)

TF-5900 L

70 ns · 6 W @ 10 kHz

Single-carriage variant: same laser, optics and measurement chain as the TF-5900A in a frame 460 kg lighter and 1285 mm shallower
Takes 4″ × 4″ panels rather than 5″ × 5″ — the trade for the smaller footprint
Keeps the GPIB active-trim capability, so choosing it over the A was a floor-space decision rather than a capability one

Original datasheet