既有設備

歷代機種

雷科自 Series 2 起推出的所有雷射調阻設備，並附原始型錄。其中許多機台至今仍在產線上運轉。

若您正在使用這些機台，本頁可協助您確認機型與其加工能力。我們持續提供備品、校正標準件與維修服務。

共通平台

以下規格在本頁所有機種之間完全相同 — 無論晶片調阻機或功能調阻機，跨越各個世代皆然。這正是探針卡、切換卡與校正標準件可全系列通用的原因，也表示熟悉 Series 2 的操作人員幾乎無需重新訓練即可操作 Series 3。

Measurement system

Mode: Dual — force current and force voltage
Range: 0.1 Ω – 30 MΩ (10 mΩ optional)
Accuracy: 0.02 % midrange
Repeatability: 0.01 % midrange
Resolution: 0.005 %
Measurement time: 50 µs
Calibration standards: 6 pcs, 0.01 %
Guard drive current: 100 mA
Guard offset: 1 mV

Switching matrix

Pins per card: 16
Lines per pin: 3 — force, sense, guard
Switch type: Dry reed relay
Contact life: 1 billion cycles
Insulation: > 10 GΩ
Switching time: 200 µs

Beam delivery and motion

Beam positioning: Precision high-speed galvanometer
Positioning resolution: 1.5 µm
Positioning repeatability: 2.5 µm
Focus lens: Flat telecentric
XY resolution: 1 µm
Theta control: Motorised

Facility requirements

Power: 220 V AC, single phase, 10 A, 50/60 Hz
Compressed air: 80 – 100 psi, 10 cfm
Vacuum: 100 CFM factory vacuum — debris removal and substrate retention

晶片調阻機

Series 2

奠定整個平台的世代。厚膜採用 1064 nm 紅外光，薄膜採用 532 nm 綠光，雙載台以 600 mm/s 運動，並配置雙料匣與升降機構。厚膜各機型的差異在於脈衝寬度 — 從 J40 的 30 ns 到 LDP 系列的 150 ns — 這也是需與您所用漿料相互匹配的關鍵參數。

機型	膜厚類型	最小晶片	波長	輸出功率	脈衝寬度	光斑尺寸	掃描範圍	機台尺寸	重量	軟體	搬送方式	型錄
TF-3050 LDP10TQ	厚膜	0.04" × 0.02"	1064 nm	6 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	2125 × 966 × 1858 mm	1000 kg	DOS (WinLts 2 optional)	Dual magazines with elevators	PDF · 0.6 MB
TF-3050 LDP15TQ	厚膜	0.04" × 0.02"	1064 nm	12 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	2125 × 966 × 1858 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.6 MB
TF-3050 J40	厚膜	0201 (0.02" × 0.01")	1064 nm	6 W @ 10 kHz	30 ns	18 – 40 µm	12 × 90 mm	1490 × 1028 × 1843.5 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.3 MB
TF-3050G BL8S	薄膜	0.04" × 0.02"	532 nm	1.5 W @ 20 kHz	7 ns	8 – 10 µm	12 × 75 mm	1490 × 1028 × 1843.5 mm	—	DOS	Dual magazines with elevators	PDF · 0.9 MB
TF-2010G Y70	厚膜	01005 (0.01" × 0.005")	532 nm	3 W @ 7.5 kHz	70 ns @ 1 kHz	11 – 25 µm	12 × 75 mm	1820 × 1070 × 2050 mm	—	LTS2010, Windows XP	Rotary control, two magazine sets	PDF · 0.7 MB

TF-3050 LDP10TQ

150 ns · 6 W @ 10 kHz

Longest pulse of the Series 2 range at 150 ns — energy is delivered over a long enough window to cut coarse thick film without chipping the ceramic beneath
Largest frame in the archive, with the laser supply in its own bay for easier service access
The last machine shipped with DOS application software; WinLts 2 was offered as an upgrade

原始型錄

TF-3050 LDP15TQ

150 ns · 12 W @ 10 kHz

12 W average power — double every other machine of the generation, and the highest in the archive alongside the Series 3 LDP15TQ
Same 150 ns pulse as the LDP10TQ, so kerf character is unchanged; the gain is purely cutting rate
Shipped with WinLts 2 on Windows XP as standard rather than as an option

原始型錄

TF-3050 J40

30 ns · 6 W @ 10 kHz

30 ns pulse — five times shorter than the LDP machines, putting less heat into the substrate and leaving a cleaner kerf edge
First of the family specified for 0201 as well as 0.04" × 0.02"
Built-in pattern recognition for auto-compensation, and intelligent sensors that detect and isolate defective parts
Roughly 30 % narrower than the LDP frames at 1490 mm

原始型錄

TF-3050G BL8S

7 ns · 1.5 W @ 20 kHz

8 – 10 µm spot — the finest in the archive, roughly a quarter of the 1064 nm machines' 18 – 40 µm, which is what thin film geometry demands
7 ns pulse at 532 nm: short and green, so very little thermal load reaches the NiCr or TaN film
TEM₀₀ beam over a 1 – 100 kHz frequency range
Carriages on independent air-cooled brushless DC servo stages, with a pneumatically counter-balanced prober
Takes 50 × 60 mm and 60 × 70 mm substrates

原始型錄

TF-2010G Y70

70 ns @ 1 kHz · 3 W @ 7.5 kHz

The only machine in the archive rated for 01005 as well as 0201 — the finest chip geometry LaserTek shipped in this era
Wireless probe card with very low contact resistance and shielded cabling, for the most stable measurement of the generation
Rotary magazine control rather than dual elevators, cutting idle time between substrates
Pattern-recognition alignment and sensors that detect part breakage along both edges
12 switching cards as standard, where the TF-3050 machines ship with 10

原始型錄

晶片調阻機

Series 3

更新的是搬送系統，而非雷射。步進重複平台以 1500 mm/s、1.2 G 加速度運行，index 時間 30 ms，並由 360 片裝（0402）料匣供料；機台同時減重 100 kg、縮減寬度 180 mm。五款機型實為同一台機器提供 50 ns 至 150 ns 五種脈衝寬度。

機型	膜厚類型	最小晶片	波長	輸出功率	脈衝寬度	光斑尺寸	掃描範圍	機台尺寸	重量	軟體	搬送方式	型錄
TF-3050 LEP50	厚膜	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	50 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LEP60/C	厚膜	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	60 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LEP70	厚膜	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	70 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LDP10TQ	厚膜	0402 cartridge (360 pcs)	1064 nm	6 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.3 MB
TF-3050 LDP15TQ	厚膜	0402 cartridge (360 pcs)	1064 nm	12 W @ 10 kHz	150 ns	18 – 40 µm	12 × 90 mm	1310 × 1028 × 1800 mm	900 kg	WinLts 3, Windows XP	Step & repeat, 1500 mm/s, single stacked elevator	PDF · 1.2 MB

TF-3050 LEP50

50 ns · 6 W @ 10 kHz

Shortest pulse of the Series 3 range at 50 ns — the cleanest cut where trim tolerance matters more than removal rate
Step-and-repeat stage at 1500 mm/s and 1.2 G with a 30 ms index — a step change over the 600 mm/s carriages of Series 2
Smallest and lightest machine in the archive at 1310 mm and 900 kg

原始型錄

TF-3050 LEP60/C

60 ns · 6 W @ 10 kHz

60 ns sits between the LEP50 and LEP70 — the middle setting when a paste cuts poorly at 50 ns but does not need 70 ns
Identical platform, handler and measurement chain to the rest of Series 3, so the choice is purely a process one

原始型錄

TF-3050 LEP70

70 ns · 6 W @ 10 kHz

Longest of the LEP pulse options at 70 ns — more energy per pulse for thicker or more resistant pastes, while staying well short of the 150 ns LDP machines
Same throughput as the rest of Series 3; the trade is cut character, not rate

原始型錄

TF-3050 LDP10TQ

150 ns · 6 W @ 10 kHz

Series 2 thick film cutting character — the same 150 ns pulse — on the faster, smaller Series 3 step-and-repeat platform
The natural upgrade path for a shop running a Series 2 LDP10TQ that wants throughput without requalifying the trim

原始型錄

TF-3050 LDP15TQ

150 ns · 12 W @ 10 kHz

The most capable machine in the archive on paper: 12 W at 150 ns on the Series 3 platform — highest power and fastest handler together
Suited to the heaviest thick film removal where cycle time governs

原始型錄

晶片調阻機

Series 5

資料庫中僅存一款機型。其公開規格與 Series 2 J40 高度相符，因此我們如實標註，而非逕行認定。

機型	膜厚類型	最小晶片	波長	輸出功率	脈衝寬度	光斑尺寸	掃描範圍	機台尺寸	重量	軟體	搬送方式	型錄
TF-3050 X30	厚膜	0201 (0.02" × 0.01")	1064 nm	6 W @ 10 kHz	30 ns	18 – 40 µm	12 × 90 mm	1490 × 1028 × 1843.5 mm	1000 kg	WinLts 2, Windows XP	Dual magazines with elevators	PDF · 0.3 MB

TF-3050 X30

30 ns · 6 W @ 10 kHz

30 ns at 1064 nm with 0201 capability and built-in pattern recognition
Rated from ohms to megohms rather than milliohms — the headline claim differs from the otherwise identical Series 2 J40 sheet

The archived Series 5 X30 datasheet is specification-identical to the Series 2 J40 apart from the resistance-range wording. Confirm with engineering before quoting this sheet as the Series 5 specification.

原始型錄

功能調阻機

TF-5900 平台

為不同任務打造的機種，現已停產。晶片調阻機掃描 12 × 90 mm 的條狀範圍、逐顆量測電阻；TF-5900 則掃描 50 × 50 mm 的面狀範圍，並透過 GPIB 儀器機櫃（電源供應器、萬用電表、訊號產生器）驅動整片電路板，在裝置通電的狀態下調阻並觀察其輸出穩定。此平台共有兩種機型：自動搬送的 A 型（早期型號為 Series 2 Y70），以及較輕巧的單載台 L 型。

機型	膜厚類型	最大板面	波長	輸出功率	脈衝寬度	光斑尺寸	掃描範圍	機台尺寸	重量	軟體	搬送方式	型錄
TF-5900 A	厚膜	5" × 5" panel	1064 nm	6 W @ 10 kHz	70 ns	20 – 40 µm	50 × 50 mm	1865 × 2355 × 1952 mm	1470 kg	LTS2010, Windows XP	Auto handler, dual carriage, two custom magazines	PDF · 0.8 MB
TF-5900 L	厚膜	4" × 4" panel	1064 nm	6 W @ 10 kHz	70 ns	20 – 40 µm	50 × 50 mm	1720 × 1070 × 1853 mm	1010 kg	LTS2010, Windows XP	Single carriage, pneumatic pick and place	PDF · 0.3 MB

TF-5900 A

70 ns · 6 W @ 10 kHz

The auto-handler frame of the functional platform: dual carriage, conveyor and transfer zone, two custom magazines
Also shipped as the Series 2 Y70 — the same machine under an earlier designation, so both datasheets describe one nameplate
GPIB interface and 7U instrument rack for trimming devices under power and measuring their final output
50 × 50 mm field with a 255 mm lens — an area rather than the 12 × 90 mm strip the chip trimmers scan

原始型錄早期型號型錄（Series 2 Y70）

TF-5900 L

70 ns · 6 W @ 10 kHz

Single-carriage variant: same laser, optics and measurement chain as the TF-5900A in a frame 460 kg lighter and 1285 mm shallower
Takes 4″ × 4″ panels rather than 5″ × 5″ — the trade for the smaller footprint
Keeps the GPIB active-trim capability, so choosing it over the A was a floor-space decision rather than a capability one

原始型錄