厚膜 · 薄膜
TF-3050 S3
Laser Trimmer S3
The S3 is the workhorse platform: image-assisted navigation paired with a precise motion control system, covering all chip resistor sizes up to 0201 in both thick and thin film, with a measurement system built for milliohm-to-megohm work.
加工範圍
- 最小晶片尺寸
- 0201
- 阻值範圍
- 1 mΩ – 30 MΩ
- 雷射波長
- 1064 / 532 / 355 nm
- 基板
- 請洽詢
設備特點
- Covers all resistor sizes up to 0201
- Measurement range from milliohms to megohms
- Image-assisted navigation paired with a precise motion control system
- Finely tunable final product holder
- Accurate and rapid measurement system
- TrimSharp reverse-cut trimming for milliohm applications
- Compact single-carriage frame
- Integrated laser power meter for accurate power measurement
- Available with infrared fibre, 532 nm green, 355 nm ultraviolet or picosecond green sources
機型配置
Series 3T with full handler
Series 3T full handler, CE marked
Series 3TG
Series 3TH
規格
標示為請洽詢的數值依應用條件確認，歡迎來信索取。
| Laser | |
|---|---|
| Laser type | Diode pumped, Q-switched |
| Wavelength | 1064 nm; 532 nm, 355 nm and picosecond green available |
| Spot size | 請洽詢 |
| Pulse repetition rate | 請洽詢 |
| Trimming envelope | |
| Minimum chip size | 0201 (inch) |
| Film type | Thick film and thin film |
| Resistance range | 1 mΩ – 30 MΩ |
| Trim geometryL-cut confirmed on thick film product | 請洽詢 |
| Trim tolerance | 請洽詢 |
| Throughput | 請洽詢 |
| Measurement | |
| Measurement range | 1 mΩ – 30 MΩ |
| Measurement resolution | 請洽詢 |
| Kelvin measurement | 請洽詢 |
| Vision and motion | |
| Alignment | Image-assisted navigation |
| Product holder | Finely tunable |
| Positioning accuracy | 請洽詢 |
| Repeatability | 請洽詢 |
| Handling | |
| Magazines | 請洽詢 |
| Substrate size | 請洽詢 |
| Software and control | |
| Operating system | Windows 10; Windows 11 on CE configurations |
| Trimmer software | WINLTS |
| Data logging / SPC export | 請洽詢 |
| Trim modes | |
| TrimSharp (reverse cut)Second pass cut in reverse at higher beam speed and lower power — cleaner kerf, less TCR shift, longer diode life | Standard |
| P-Mode cut types | L-cut, line cut, ¼ circle cut, dummy cut |
| Segmented cuts | Segmented box, segmented U |
| Safety and compliance | |
| CE marking | CE marked (S8T CE configuration) |
| Safety door interlock | Interlocked enclosure, CE certified |
| EMC | EMC tested to CE requirements |
| Operator signalling | Three-colour signal tower, emergency stop |
| Enclosure | Fully enclosed beam path with laser-safety viewing window |
| Labelling | Safety terms and symbols to CE marking requirements |
| Facility | |
| Footprint | 請洽詢 |
| Power | 請洽詢 |
| Compressed air | 請洽詢 |
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